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LANDON, GREATER LANDON, UK, December 19, 2023 /EINPresswire.com/ -- Year End Offer By The Business Research Company - Get 33% Discount On Opportunities And Strategies Reports And 25% Discount On Global Market Reports
The Business Research Company’s “Fan-Out Wafer Level Packaging Global Market Report 2024 is a comprehensive source of information that covers every facet of the market. As per TBRC’s market forecast, the fan-out wafer level packaging market size is predicted to reach the fan-out wafer level packaging market size has grown rapidly in recent years. It will grow from $2.13 billion in 2023 to $2.43 billion in 2024 at a compound annual growth rate (CAGR) of 14.1%. The growth in the historic period can be attributed to miniaturization of electronics, increased integration, improved electrical performance, global expansion.The fan-out wafer level packaging market size is expected to see rapid growth in the next few years. It will grow to $3.94 billion in 2028 at a compound annual growth rate (CAGR) of 12.8%.
The growth in the fan-out wafer level packaging market is due to the increasing demand for IoT devices. Asia-Pacific region is expected to hold the largest fan-out wafer level packaging market share. Major players in the fan-out wafer level packaging market include Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, Qualcomm Inc., Fujitsu Limited.
Fan-Out Wafer Level Packaging Market Segments
1. By Process Type: Standard-Density Packaging, High-Density Packaging, Bumping
2. By Business Model: Outsourced Semiconductor Assembly and Test (OSAT), Foundry, Integrated Device Manufacturer (IDM)
3. By Application: Consumer Electronics, Industrial, Automotive, Healthcare, Aerospace And Defense, IT And Telecommunication, Other Applications
4. By Geography: The global fan-out wafer level packaging market is segmented into North America, South America, Asia-Pacific, Eastern Europe, Western Europe, Middle East and Africa.
Learn More On The Market By Requesting A Free Sample (Includes Graphs And Tables):
https://www.thebusinessresearchcompany.com/sample_request?id=13037&type=smp
Fan-Out WLP (FOWLP) refers to a technological improvement to regular wafer-level packages (WLPs) designed to provide a solution for semiconductor devices requiring a higher integration level and more significant external contacts. It has a lower package footprint, more input/output (I/O) and better thermal and electrical performance. It has various advantages and can increase the number of connections without increasing the die size.
Read More On The Fan-Out Wafer Level Packaging Global Market Report At:
https://www.thebusinessresearchcompany.com/report/fan-out-wafer-level-packaging-global-market-report
The Table Of Content For The Market Report Include:
1. Executive Summary
2. Fan-Out Wafer Level Packaging Market Characteristics
3. Fan-Out Wafer Level Packaging Market Trends And Strategies
4. Fan-Out Wafer Level Packaging Market – Macro Economic Scenario
5. Fan-Out Wafer Level Packaging Market Size And Growth
……
27. Fan-Out Wafer Level Packaging Market Competitor Landscape And Company Profiles
28. Key Mergers And Acquisitions In The Market
29. Fan-Out Wafer Level Packaging Market Future Outlook and Potential Analysis
30. Appendix
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