What Are the Hidden Risks in TSMC’s Latest U.S. Subsidy Agreement?

November 15, 2024 09:59 PM AEDT | By Team Kalkine Media

What Are the Hidden Risks in TSMC’s Latest U.S. Subsidy Agreement? — Image source: Shutterstock

Expansion of Advanced Manufacturing Facilities

TSMC has committed to expanding its Arizona investment to include a third semiconductor fabrication plant by 2030, further elevating the region's prominence in global chip production. The company's facilities will deploy cutting-edge 2-nanometer technology at the second fab, set to commence operations in 2028. Additionally, the advanced A16 chip manufacturing technology will be implemented, emphasizing innovation in U.S. production capabilities.

Strategic Financial Support and Milestones

The agreement includes up to $5 billion in low-cost loans, alongside cash disbursements tied to project milestones. By the end of the year, TSMC is expected to receive at least $1 billion under this framework. In return, TSMC has agreed to limit stock buybacks for five years and share excess profits with the U.S. government through an "upside sharing agreement."

Commerce Secretary Gina Raimondo highlighted the strategic nature of these efforts, emphasizing national security considerations and the importance of reshoring chip production. The program also aims to bolster supply chains and encourage American firms to prioritize domestically produced chips.

Broader Implications for the Semiconductor Sector

This development underscores the growing importance of fostering advanced semiconductor manufacturing domestically. The CHIPS and Science Act has allocated substantial resources to other projects, including Samsung, Intel, and Micron Technology, to establish the United States as a hub for cutting-edge chip development.

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