SandBox Semiconductor collaborates With Siemens in Virtual Semiconductor Manufacturing

andBox Semiconductor, an innovative predictive AI company offers a process optimization tool that was awarded a prestigious grant from the USA’s National Science Foundation under the Technology Enhancement for Commercial Partnerships (TECP) SBIR program late 2021. It aims to support a collaboration between SandBox Semiconductor and Siemens Digital Industries Software Siemens is a global leader in electronic design automation (EDA) software. The collaboration leverages SandBox’s cutting-edge, physics-based 3D simulation technologies The goal of the collaboration between SandBox and Siemens is to demonstrate a tool to simulate the 3D etch propagation of post-lithography profile predictions generated by Siemens’ Calibre® OPC verify software module using SandBox’s modeling toolsets. 

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